19 October 2017

Creditcall and NXP form EMV kernel collaboration

02 February 2015  |  2294 views  |  0 Source: Creditcall

Creditcall, the EMV-ready payment gateway provider and EMV Migration specialist, today announced a new collaboration with NXP Semiconductors N.V. (NASDAQ:NXPI), ahead of Smart Card Alliance's Payment Summit in Salt Lake City, Utah on February 3-5.

Creditcall will combine an evaluation version of its EMV Level 2 Contact and Contactless Kernels with NXP's range of proven payment-compliant smart card interfaces in a convenient hardware and software reference demonstrator for secure near field communication (NFC)-enabled Mobile Point of Sale (mPOS) solutions. The EMV Kernels are the software components that control communication between an EMV chip card terminal and contact or contactless EMV chip card.

Market Leaders Bring Enhanced Usability and Profitability to Manufacturing

The collaboration will enable PIN Entry Device (PED) manufacturers to test the feasibility of using both technologies in their own designs in order to dramatically reduce risk, cost and time to market.

With more than 15 years EMV experience and one million Creditcall EMV Kernels deployed worldwide in ATMs, PINpads, mPOS solutions, parking payment terminals, vending machines, kiosks and a multitude of other devices, Creditcall's EMV Kernels are recognized as the most adopted, deployed and trusted in the world.

NXP Semiconductors is a $4.82 billion global company with operations in more than 25 countries and is the largest supplier of contact and contactless interfaces for PEDs and secure smart card controllers for payment applications.

Paul Hubmer, General Manager, NFC reader solutions, NXP Semiconductors said, "Partnering with Creditcall allows us to reach new markets with our new mPOS demonstrator, giving customers access to an extremely impressive range of contact and contactless EMV Level 2 Kernels. Mobile point-of-sale units not only provide merchants and retailers increased opportunity to sell, they also offer consumers a new simplicity and freedom in payment options."

"This collaboration is a strategic win for all as it provides a more complete EMV offering to PED manufacturers than has previously existed, said Jeremy Gumbley, Chief Technology Officer at Creditcall. "By combining two of the most reputable solutions in the world from Creditcall and NXP, PED manufacturers worldwide now have access to a risk free path to EMV which is faster, easier and more cost effective." 

Comments: (0)

Comment on this story (membership required)

Related blogs

Create a blog about this story (membership required)
visit www.vasco.comvisit www.capgemini.com

Top topics

Most viewed Most shared
Ripple looks to drive bank adoption with $300m XRP rebate programmeRipple looks to drive bank adoption with $...
15570 views comments | 12 tweets | 4 linkedin
Swift positive on blockchain, but big challenges remainSwift positive on blockchain, but big chal...
8755 views comments | 16 tweets | 22 linkedin
hands typing furiouslyHow artificial intelligence can deliver a...
8403 views 0 | 8 tweets | 9 linkedin
satelliteGates Foundation backs Ripple collaboratio...
7850 views comments | 13 tweets | 10 linkedin
IBM uses blockchain to improve cross-border payments processingIBM uses blockchain to improve cross-borde...
6997 views comments | 9 tweets | 17 linkedin

Featured job

Competitive
London, UK (or flexible)

Find your next job