Ingenico today announced at the Electronic Transaction Association Annual General Meeting and Expo, Las Vegas, that it has launched two families of Telium-based transaction terminals, the iCT200 series of countertop and the ML30 series of PIN Pads.
The new iCT 200 series terminals combine outstanding performance and communication capabilities; the latest PCI-PED v2.0 security and the revenue opportunities from countless value added services in one unique family. Ergonomic design and a colour screen on the ICT250 deliver a significantly improved user experience. The integration of state-of-the-art technologies into the chipsets of the terminal has created clear competitive advantage in terms of performance and security. The heart of the terminal is made of two chips: one manages the security and sensitive devices (e.g. keyboard, readers, display, tamper detection switches etc.), while the other manages the applications and communications. The design of this new platform combines the highest levels of security with the market's most advanced feature set to provide the best possible payment solution for end-users. These new terminals are based on Ingenico's Telium hardware and software architecture, one of the most advanced in the industry.
"The Telium advantage is real" says Lisa Shipley, SVP Sales, Ingenico North America. "With the Telium II based platform, merchants receive the most advanced transaction terminal technology today. These terminals have the fastest processing speed of any device sold, with the capability of handling 500 million instructions per second. Our dual-chip platform dedicates one chip to processing and protecting security and its relative components and circuitry, while the other chip handles the application processing. This design leads to faster performance, stronger security and greater versatility in transaction applications processing. An added benefit is the increased reliability our board and chip design bring to the terminal. We have reduced 50 percent of the electronic components by building better, stronger and more reliable chips to take their place" continued Shipley.